Wafer inspection has become a critical part of the semiconductor manufacturing process. Inspections performed after wafer test can analyze the marks left by probe cards to ensure that the test process ...

In a heterogeneous integrated system, the impact of composite yield fallout due to a single chiplet is creating new performance imperatives for wafer test in terms of test complexity and coverage.

The move to multi-die packaging is driving chipmakers to develop more cost-effective ways to ensure only known-good die are integrated into packages, because the price of failure is significantly ...

In this interview, Dr. Chady Stephan, PhD, the Applied Markets Leader at PerkinElmer, talks to AZoM about the current trends shaping semiconductor wafer manufacturing. A semiconductor is a material ...

Semiconductors are the essential component fueling the growth of industries such as automotive, renewable energy, communications, information technology, defense, and consumer electronics. The rise of ...

Increased productivity and efficiency with one-pass test enabled by a high-voltage switching matrix Designed to enhance the safety of operators and equipment; complies with regulations SANTA ROSA, ...

Keeping an IC cool takes on new meaning when power dissipation exceeds 150 watts. Innovative electrical and mechanical solutions to new wafer testing challenges continue to be developed. For example, ...

Wafer-to-wafer hybrid bonding process capable of achieving a 200-nanometre copper interconnect pitch demonstrated.

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This higher density of circuitry on a wafer requires greater accuracy and a highly fragile and advanced fabrication process. Several newer and highly complex ICs today are made of a dozen or more ...