IBM just unveiled the world's first sub 1-nanometer chip: 100 billion transistors. IBM also says they've produced functioning ...

As demand grows for more powerful and efficient microelectronics systems, industry is turning to 3D integration—stacking chips on top of each other. This vertically layered architecture could allow ...

Applied Materials (NasdaqGS:AMAT) announced a major expansion of its product suite focused on next generation AI chip ...

Artificial intelligence is colliding with a hard physical limit: the energy it takes to move data on and off chips. Training and running large models is already straining power grids and corporate ...

POSTECH and KITECH developed an ultrathin chip stacking process with fourfold higher density than current memory. They ...

Researchers can now fabricate a 3D chip with alternating layers of semiconducting material grown directly on top of each other. The method eliminates thick silicon substrates between the layers, ...

Chipmaking equipment giant Applied Materials Inc. is trying to make life easier for its chip fabrication plant customers, so ...

Intel has a new 3D technology to allow for 3D chip stacking, despite previous problems with this type of capability. Share on Facebook (opens in a new window) Share on X (opens in a new window) Share ...

You have reached your maximum number of saved items. Remove items from your saved list to add more. IBM has found a way to connect chips inside products ranging from cell phones to supercomputers, an ...