Samtec, a privately held $662MM global manufacturer of a broad line of electronic interconnect solutions, proudly announces the release of the Direct Connect™ Horizontal (DCH) High-Speed Press-Fit ...
SAN JOSE, Calif., Sept. 19, 2019 (GLOBE NEWSWIRE) -- eSilicon, a leading provider of FinFET-class ASICs, market-specific IP platforms and advanced 2.5D packaging solutions, and Samtec, a leading ...
Samtec is releasing a variety of board-level and cable connector systems for JTAG applications, which are currently shipping in volume quantities, says the interconnect manufacturer. The Samtec JTAG ...
Samtec claims the 1.35-mm board connectors (135 Series) are the industry’s only vertical compression-mount product using the 1.35-mm interface. The solderless launch eases assembly to the board. They ...
January 23, 2019 -- eSilicon, a leading provider of FinFET-class ASICs, market-specific IP platforms and advanced 2.5D packaging solutions, will team up with Samtec to demonstrate eSilicon’s 7nm 56G ...
SAN JOSE, Calif., Sept. 19, 2019 (GLOBE NEWSWIRE) -- In a release issued under the same headline today by eSilicon Corporation, please note that in the headline of the release, it should be ...
Mouser has brought out a new eBook in collaboration with Samtec, exploring the challenges of high-speed designs and the new cable technologies emerging to address them. In Samtec Flyover Solutions ...
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