The focus has been on Intel Foundry's ability to compete on fab process nodes. But advanced packaging is the foundation on which it is building its success.

Biodegradable packaging from mycellium and agriculture waste produced by S.Lab for Loreal. A German pharmacist invented polystyrene in 1839. Today, the production of polystyrene produces more than ...

Samsung Electronics is not only the first company in the world to launch a labor-free semiconductor packaging line, but it has also set a goal of converting its packaging plants to be human labor-free ...

Subscribe to our newsletter for the latest sci-tech news updates. A team in the Department of Sustainable Biomaterials developed a water-based process to create multilayer bioplastic films that are ...

Semiconductor manufacturing faces a new bottleneck. See how advanced packaging and laser-based tooling fix back-end supply chains.

An insatiable demand for logic to memory integration for AI and high-performance computing is driving progress toward very large-format packages, which are expected to approach 10 times the maximum ...

Intel Corp. has shared new information about Intel 14A, an upcoming chip manufacturing process that will use ASML Holding NV’s most advanced lithography machines. Executives detailed the process today ...

Can KLA's AI-driven packaging boom and rising chip complexity power advanced packaging revenues to $1B by 2026?

Fundamental to all digital technologies, semiconductor chips are a major focal point in twenty-first-century geoeconomic competition. Nations see it as an imperative to invest heavily in semiconductor ...