Design for manufacturability (DFM) issues moved into the mainstream with unexpectedly low yields at the 130-nanometer node. While these issues were surprising at 130nm, at 90nm and below they become ...
SAN FRANCISCO — The development of robust process models that can easily be integrated into the design flow is the single most important step toward helping the semiconductor industry overcome the ...
SAN JOSE, Calif.--(BUSINESS WIRE)--Cadence Design Systems, Inc. (NASDAQ: CDNS) today announced that it has launched a broad ecosystem with nine initial printed circuit board (PCB) manufacturing ...
Our current concept of DFM is not really manufacturing-aware. With designs scaling down to 130 nm and below and process complexity increasing correspondingly, the impact of process-induced variation ...
DFM is not a single technique or tool—it’s really about addressing a variety of manufacturing issues during the design process. We’re witnessing an interesting phenomenon in the SoC segment of the ...
Family histories are all the rage these days. With the advent of online databases, what was once a difficult and expensive task is now accessible to anyone with Internet access. Not only can you ...
With semiconductor feature sizes continuing to shrink, the variability arising from process technologies such as strained silicon, as well as the manufacturing processes themselves at 45 nm and below, ...
WAKEFIELD, R.I.--(BUSINESS WIRE)--Boothroyd Dewhurst, Inc., developer of internationally recognized Design for Manufacture and Assembly (DFMA®) software, announces the availability of DFM Concurrent ...
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