A new wave of 2.5D/3D, fan-out and other advanced IC packages is expected to flood the market over the next year. The new packages are targeted to address many of the same and challenging applications ...

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Several companies are racing each other to develop a new class of 2.5D and 3D packages based on various next-generation interconnect technologies. Intel, TSMC and others are exploring or developing ...

Tristan Jurkovich began his career as a journalist in 2011. His childhood love of video games and writing fuel his passion for archiving this great medium’s history. He dabbles in every genre, but ...

The 2.5D glass trend sounds like stereotypical marketing jargon… how can something exist between two and three dimensional space anyway? However, the term is actually based on a real design factor, it ...