Spanish researchers from the Public University of Navarra (UPNA) and the National Renewable Energy Centre (CENER) have investigated the melting points of three conventional encapsulant materials in an ...
A screening method aligned with USP 1660 guidance predicts glass delamination in primary packaging for parenterals. While many factors contribute to the recent surge in glass delamination recalls, it ...
The molding materials used to package lead-free components differ from conventional epoxies in two ways: They take up moisture more slowly, and they better resist higher temperatures. But at the ...
The purpose of this CAN is to notify DJI Agras T50 and DJI FlyCart 30 operators of a recent report from industry of a manufacturing defect in DJI T50 and FC30 aircraft whereby the composite outer ...
As semiconductor technology scales down in size, process integration complexity and defects are increasing in 3D NAND flash, partially due to larger stack deposits and thickness variability between ...
Variation is becoming a bigger problem in multi-die assemblies with TSVs and hybrid bonding. Multi-modal approaches are required to test these devices. AI plays a role in improving defect capture rate ...
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