Materials scientists at Rice University have developed a new workflow methodology for measuring microscopic defects in ...

Detecting sub-5nm defects creates huge challenges for chipmakers, challenges that have a direct impact on yield, reliability, and profitability. In addition to being smaller and harder to detect, ...

Detecting macro-defects early in the wafer processing flow is vital for yield and process improvement, and it is driving innovations in both inspection techniques and wafer test map analysis. At the ...

One of the challenges of cramming smarter and more powerful electronics into ever-shrinking devices is developing the tools and techniques to analyze the materials that make them up with increasingly ...

New research offers an enhanced understanding of common defects in transition-metal dichalcogenides (TMDs) -- a potential replacement for silicon in computer chips -- and lays the foundation for ...

Researchers in China have developed a novel deep learning model to detect defects in photovoltaic panels. The approach leverages high-resolution visible light imaging to identify defects using an ...

SiC is extensively used in microelectronic devices owing to its several unique properties. However, low yield and high cost of the SiC manufacturing process are the major challenges that must be ...