RANOVUS’ standards compliant Odin® direct-drive CPO 2.0 optical interconnect, with 5pJ/bit energy efficiency, is best-in-class for co-packaged, near-packaged optics and pluggable module form factors ...

IICIE Emphasizes semiconductor materials, wafer fabrication equipment, packaging and testing, 2.5D/3D advanced packaging, and ...

Elite Advanced Laser (eLaser), a Taiwan-based provider of optical communication solutions, is strategically adapting to the demands of the AI-driven era, with a particular focus on silicon photonics ...

As AI model training scales up and cloud service providers (CSPs) accelerate the buildout of high-performance data centers, switch bandwidth is moving from 51.2Tbps to the 102.4Tbps generation, ...

Optical interconnects, leveraging intrinsic advantages such as high bandwidth, low loss, and immunity to electromagnetic interference (EMI), are thus regarded as a promising solution to these barriers ...

IBM is developing co-packaged optics (CPO) technology to replace conventional electrical interconnects in chips, which it says will speed up AI model training and increase energy efficiency for data ...

Why co-packaged optics (CPO) are needed in high-performance computing (HPC). How IBM delivers CPO. What CPO means for HPC applications like artificial intelligence and machine learning. Providing high ...

Ranovus’ Odin™ Analog-Drive CPO 2.0 eliminates the need for the retimer, resulting in 75% smaller footprint and 40% cost and power consumption savings in the Optical Interconnect. SAN DIEGO--(BUSINESS ...

At OFC, GlobalFoundries made several announcements in conjunction with partners that showcased GlobalFoundries' robust ...

The optical communication sector, considered a core infrastructure of artificial intelligence (AI) data centers, has recently experienced a significan ...