Q: Are chiplets simply an evolution of multi-chip modules (MCMs) from the 1990’s? A: In many ways, yes. Early multi-chip ...
Purdue University is working toward the future in microelectronic product development with the creation of the Institute for Advanced System Integration and Packaging (ASIP) to enable faster designing ...
Advanced packaging options continue to stack up in the pursuit of “More than Moore” and higher levels of integration. It has become a place where many high-density interconnects converge, and where ...
SINGAPORE, Feb. 3, 2026 /PRNewswire/ -- FIC Global, Inc. (TWSE: 3701; FICG), with PRIME Technology as its optical communications brand, will participate in Asia Photonics Expo (APE) 2026, taking place ...
As we enter the AI era, the demand for enhanced connectivity in cloud services and AI computing continues to surge. With Moore’s Law slowing down, the increasing data rate requirements are surpassing ...
Qnity Electronics, Inc. ("Qnity") (NYSE: Q), a premier technology solutions leader across the semiconductor value chain, today announced the launch of its Advanced Packaging Innovation Hub, ...
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Intel Announces Leadership Appointment at Intel Foundry to Accelerate Development and Manufacturing
Intel Corporation today announced the appointment of Seok-Hee Lee as executive vice president of Intel Foundry, reporting directly to CEO Lip-Bu Tan. In this role, Lee will lead all advanced packaging ...
Thousands of attendees gathered at ECTC to explore the latest advances in advanced packaging, AI-driven design, heterogeneous integration and thermal management. More than 2,700 attendees conversed ...
3D IC chiplet-based heterogeneous package integration represents the next major evolution in semiconductor design. It allows us to continue scaling system performance despite the physical limitationA ...
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