Strategic Materials Conference 2026 highlights AI materials, advanced packaging, quantum technologies and semiconductor ...

Sixteen miles north of Albuquerque, in Rio Rancho, New Mexico, an Intel chip plant sits on more than 200 acres of land. The site was established in the 1980s, part of it built on top of a sod farm. In ...

Stocks Boosting Dividends; KLA (NASDAQ:KLAC) is seeing stronger momentum across semiconductor equipment markets than it expected earlier in the y ...

Thousands of attendees gathered at ECTC to explore the latest advances in advanced packaging, AI-driven design, heterogeneous integration and thermal management. More than 2,700 attendees conversed ...

Terence Gan, Executive Director of Singapore's A*STAR Institute of Microelectronics (A*STAR IME), delivered a confident address at the 2025 Advanced Packaging Developers Conference (APDC), unveiling ...

Nvidia’s CEO Jensen Huang has made waves by saying that his company’s most advanced artificial intelligence (AI) chip, Blackwell, will transition from CowoS-S to CoWoS-L advanced packaging technology.

Packaging houses are readying the next wave of advanced IC packages, hoping to gain a bigger foothold in the race to develop next-generation chip designs. At a recent event, ASE, ...

Naura Technology Group has shipped its first 600mm × 600mm panel-level packaging descum tool, marking a key step in the Chinese semiconductor equipment maker's move from wafer-level... Test Research, ...